問題詳情
47. Which of the following is used in film deposition:
(A) sputtering,
(B) chemical-vapor deposition,
(C) lowpressure chemical-vapor deposition,
(D) plasma-enbanced chemical-vapor deposition,
(E) all of the above?
參考答案
答案：[無官方正解]
難度：計算中-1
書單：沒有書單，新增