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• 【題組】35. (A) Throughout (B) Yet (C) So (D) With
• Passage 4: Questions 36-40 In 1928 a __(36)__ examiner named Harrison Mattland published a famous pa
• 【題組】37. (A) said (B) spoken (C) atgued (D) dismissed
• 【題組】38. (A) essence (B) tip (C) entity (D) substance
• 【題組】39. (A) scas sonal (B) occupational (C) diutnal (D) periodical
• 【題組】40. (A) has been (B) would be (C) were to be (D) had been
• Article 1: Questions 41-45 When joutnalists and academics talk about the morass of hate and ies onli
• 【題組】42. According to this article, which of the following statements is TRUE?(A) Social media are an
• 【題組】43. Accotding to this article, what do social media do?(A) polatization(B) unification(C) harmon
• 【題組】44. In which of the position marked IW], A], [Y], and [Z] does the following sentencebest belong
• 【題組】45. What is the meaning of the idiom "grist ... to the mill' in the second patagtaph?(
• Article 2: Questions 46-50 Jonathan D. Spence, a British-botrn historian who became a longtime Yale
• 【題組】47. Accotding to this atticle, which of the following is not covered by "The Search forMode
• 【題組】48. Which of the following would be the best choice for the blank [AP(A) a dramatic intrigue(B)
• 【題組】49. According to the passages from Spence quoted in this article, what is his evaluationof Chine
• 【題組】50. In which of the position marked [S], [T], [U], and [V] does the following sentencebest belon
• 一、軟體開發流程（Software development process）對於建置一個資訊系統的成功非常重要，包含需求分析、架構設計、細部設計、程式撰寫、測試與維護。【題組】(一)請比較計畫驅動（P
• 23. 沉澱反應可以熱力學平衡常數來做反應方向性的判斷，以下哪個敘述是指向沉澱反應的發生？(A) K＞Q (B) K=Q (C) K＜Q (D) K=0
• 11. 下列何者不是穩定的系統？(A) (B) (C) (D)
• 一、有一簡支 H 型鋼梁，跨距為 8.8 m，全跨承受因數化載重 wu = 8 tf/m，型鋼斷面強軸承受彎矩。鋼梁為熱軋 H 型鋼 H600 ✖ 200 ✖ 11 ✖ 17，為塑性設計斷面，鋼材降伏
• 2. 印刷電路板是以電氣連結及承載元件為主要功能，下列哪一項並非硬式電路板所具備的特性？(A)良好絕緣性；(B)線路高電阻；(C)高強度；(D)高耐熱。
• 3. 在過去短短幾年，軟式銅箔基板(Flexible CCL)的用途已快進的擴展到 3C 電子產品，以及家用消費性電子產品上。下列何者不是軟式銅箔基板快速發展的原因?(A)不適合極冷的環境；(B)尺寸
• 4. 電路板的絕緣材料是一種有機高分子的塑料應用，下列何者是熱塑性塑料？(A)聚醯亞胺 PI；(B)聚四氟乙烯 PTFE；(C)聚酯基板 PET；(D)酚醛樹脂 PF。
• 5. 關於印刷電路板敘述下列何者是錯誤的？(A)埋入式電路板內安裝主被動元件，可有效縮短訊號傳輸路徑和改善電性；(B)常使用厚銅技術提供多層電路板的高電流需求；(C)軟硬結合板藉由製程設計將硬板和軟板
• 6. 電路板基材使用的絕緣材料可分為有機材質和無機材質，下列何者電路板的絕緣是屬於無機材質？(A)PTFE(鐵氟龍基板)；(B)Ceramic(陶瓷基板)；(C)PI(聚醯亞胺軟板)；(D) FR-4